3D rotational view plus 90° BGA inspection mirror provide unprecedented optical BGA inspection capability at 90° view for QC and failure analysis at very affordable price for circuit board manufacturers using BGA and QFP. The system is very easy to use and extremely robust for production environment. Real time view of BGA inspection, capturing defect image for documentation, and performing dimensional measurement on BGA ball size and pitch, all with better image clarity and less expensive than X-ray system.

• 1080p HD 6MP camera for real-time HD image inspection
• 3D rotational mirror to see BGA side view in real time 3D
• Capture image without a computer
• Measure software included for computer USB2.0 connection