High Thermal Conductive Metal Clad Laminate
♣ FR-HTL1000 |
特點
- High heat dissipation
- Good circuit workability
- Excellent thermal durability
|
應用
- LED,PDP,Regulator for TV LED light
- inverter & converter
- lgniter, voltage regulator
- Rectifier , Power supply
|
♣ FR-HTL2000 |
應用
- LED,3D LED ,Regulator for TV Module
- Personal computer. notebook computer
- Cellular phone ,A/V device etc
|
|
|
-- 型式 -- |
♣ FR-HTL1000 |
♣ FR-HTL2000 |
copper foil |
circuit layer
(0.5~3 oz) |
|
Epoxy + Ceramic Filler |
Dielectric layer
(100um) |
|
|
Substrate
(0.3~3.0mm) |
Metal Plate(AL base, copper) |
|
copper foil |
circuit layer
(0.5~3 oz) |
|
Epoxy + Ceramic Filler |
Dielectric layer
(100um) |
|
|
|
|
-- 測試 -- |
Test Item |
Unit |
Test Condition |
FR-HTL1000
FR-HTL2000 |
Flammability |
. |
UL94 |
v-0 |
solder Float ( 288 C) |
min |
A |
above 10 |
solder Float ( 260 C) |
min |
A |
above 30 |
Peel Strength (1 oz Cu) |
kgf/cm |
A |
3.5 |
Thermal Conductivity) |
W/mk |
A |
2.0 |
Dielectric Breakdown voltage |
Ac kV |
A |
above 3.0 |
Comparative Tracking index |
volt |
IEC Method |
600.0 |
Dielectrc Constant |
|
1MHz |
6.0 |
1GHZ |
5.6 |
Dissipation Factor |
|
1MHz |
0.014 |
1GHZ |
0.016 |
|
|